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MIL-T-10727, Type I. ASTM B 545 and other specifications |
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Certificates of compliance provided at customer request |
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Fischerscope X-Ray available for precise measurement of plating thickness |
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Hydrogen embrittlement relief available |
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Custom masking and polishing also available |
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Quality Control Manual available upon request |
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Applied on ferrous or non-ferrous metals. Tin is a ductile metal often used to impart solderability and conductivity. It covers well but some substrates will react with the tin, forming non-solderable intermetallic layers, caused by migration of substrate components into the tin. Migration can often be minimized by undercoating with a layer of nickel or copper. Tin will not tarnish easily and is often used for decorative purposes.
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