 |
| |
MIL-C-14550B Class I, II, III. IV, ASTM B 734, AMS 2418 and other specifications |
|
|
|
| |
Certificates of compliance provided at customer request |
|
|
| |
Fischerscope X-Ray available for precise measurement of plating thickness |
|
|
| |
Hydrogen embrittlement relief available |
|
|
|
|
| |
Custom masking and polishing also available |
|
|
|
|
| |
Quality Control Manual available upon request |
|
Applied on ferrous or non-ferrous metals. Copper is highly conductive and provides good solderability. It can be used as an underplate (or “strike”) which can aid in covering minor base metal surface imperfections. Copper is often used for undercoating, to lubricate (anti-galling), to prevent case hardening, to enable tinning, etc.
Because copper has excellent leveling properties and very high throwing efficiency, it makes an excellent undercoat for most other metals. In addition, because copper is ductile, it polishes easily to a high shine so that it supports a bright, shiny finishing metal above it.
|
